The Center for Advanced Materials Processing CAMP at Clarkson University gathered industry leading experts August 16-19, 2021 to the 24th international symposium on Chemical Mechanical Planariztion CMP. CMP is a critical process step in the manufacture of integrated devices in the microelectronics industry.
Okmetic and KxS Technologies were jointly invited to speak about the positive results of inline refractive index liquid measurements of CMP slurry density. CMP slurries are used as a liquid agent in silicon wafer planarization in multiple steps during the wafer processing. A drifting slurry density or H2O2 oxidizing agent concentration has a direct impact on polish removal rate RR.
The findings encourage the entire CMP community from slurry manufacturers, slurry delivery system manufacturers, facilites engineers to process engineers, to unify by having a standard way of reporting slurry density. All that with the motivation to rule out slurry composition excursions when mitigating planarization defectivity.