KxS in-situ refractive index: The industry standard for semiconductor fab chemical monitoring

When it comes to balancing cost, speed, and accuracy in semicon chemical concentration measurements throughout the fab distribution chain, in-situ refractive index has become the industry standard. KxS semiconductor

DCM-10 fab chemical monitor is expertly designed to:

  • Define incoming delivery clean chemical concentration and raw CMP slurry density.
  • Achieve and ensure precise H2O2 concentration and DI water dilutions in colloidal silica-type CMP slurries used in copper, tungsten, and interlayer dielectric planarization applications.
  • Correlate concentration measurements with wafer etch rates (ER) in processes such as buffered oxide etch (BOE).
  • Optimize the bath life of post-etch residue removers like EKC265™ in wet strip spinning tools.

Our semiconductor fab chemical monitor is ideal for a variety of applications, including:

  • Chemical blend checksum of SC-1 and SC-2
  • Hard mask etching with NH3 water mixes
  • Silicon wet etch with 50% KOH
  • Titanium etch with H2SO4:HNO3:H3PO4 mixes
  • Back side poly etch with HF:HNO3 mixtures
  • Post-CMP cleans with various mixtures

Our technology is capable of monitoring a wide range of critical semiconductor chemicals, including but not limited to:

  • Hydrogen peroxide (H2O2)
  • Ammonium hydroxide (NH3 water)
  • Dilute hydrofluoric acid (HF)
  • Phosphoric acid (H3PO4)
  • Hydrochloric acid (HCl)
  • Sodium hydroxide (NaOH)
  • Sulfuric acid (H2SO4)
  • N-methyl pyrrolidone (NMP)
  • Tetramethylammonium hydroxide (TMAH)
  • Iso-propyl alcohol (IPA)
  • Potassium hydroxide (KOH)
  • Nitric acid (HNO3)
  • Polyethylene glycol (PEG)
  • Citric acid (C6H8O7)
  • Acetic acid (CH3COOH)

Experience unparalleled precision and efficiency in your chemical monitoring processes with KxS Technologies' advanced solutions and expertise.

Book a consultation with our experts and let's define together the best solution for your application needs.

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