KxS in-situ refractive index: The industry standard for semiconductor fab chemical monitoring
When it comes to balancing cost, speed, and accuracy in semicon chemical concentration measurements throughout the fab distribution chain, in-situ refractive index has become the industry standard. KxS semiconductor
DCM-10 fab chemical monitor is expertly designed to:
- Define incoming delivery clean chemical concentration and raw CMP slurry density.
- Achieve and ensure precise H2O2 concentration and DI water dilutions in colloidal silica-type CMP slurries used in copper, tungsten, and interlayer dielectric planarization applications.
- Correlate concentration measurements with wafer etch rates (ER) in processes such as buffered oxide etch (BOE).
- Optimize the bath life of post-etch residue removers like EKC265™ in wet strip spinning tools.
Our semiconductor fab chemical monitor is ideal for a variety of applications, including:
- Chemical blend checksum of SC-1 and SC-2
- Hard mask etching with NH3 water mixes
- Silicon wet etch with 50% KOH
- Titanium etch with H2SO4:HNO3:H3PO4 mixes
- Back side poly etch with HF:HNO3 mixtures
- Post-CMP cleans with various mixtures
Our technology is capable of monitoring a wide range of critical semiconductor chemicals, including but not limited to:
- Hydrogen peroxide (H2O2)
- Ammonium hydroxide (NH3 water)
- Dilute hydrofluoric acid (HF)
- Phosphoric acid (H3PO4)
- Hydrochloric acid (HCl)
- Sodium hydroxide (NaOH)
- Sulfuric acid (H2SO4)
- N-methyl pyrrolidone (NMP)
- Tetramethylammonium hydroxide (TMAH)
- Iso-propyl alcohol (IPA)
- Potassium hydroxide (KOH)
- Nitric acid (HNO3)
- Polyethylene glycol (PEG)
- Citric acid (C6H8O7)
- Acetic acid (CH3COOH)
Experience unparalleled precision and efficiency in your chemical monitoring processes with KxS Technologies' advanced solutions and expertise.
Book a consultation with our experts and let's define together the best solution for your application needs.